专利名称：Tin alloy plating solution 发明人：巽 康司，八十嶋 司，片瀬 琢磨申请号：JP2017222433
申请日：20171120
公开号：JP6432667B2
公开日：
20181205
专利内容由知识产权出版社提供一村一大
摘要： To provide a tin alloy plating solution which is excellent in electrolytic stability and aging stability, and has good appearance and uniform film thickness of a plated film. SOLUTION: This tin alloy plating solution contains a soluble tin salt, a soluble salt of a nobler than tin, and a sulfide compound represented by the following general formula (1). In the formula (1), n is 1 to 3. It is preferable that the nobler than tin is silver, copper, gold or bismuth. [Chemical Formula 1] [Selection drawing] None
申请人：三菱マテリアル株式会社
地址：東京都千代田区大手町一丁目３番２号
国籍：JP
代理人：須田 正義，村澤 彰
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